Complete set of equipment for recycling waste circuit boards
"Waste circuit board recycling technology and complete set of equipment" introduces advanced foreign technology, comprehensively considers safety and environmental protection, and aims at resource regeneration and maximizing benefits. Effectively recycle valuable metals such as copper, tin, iron, aluminum, gold, silver, palladium, etc. in waste circuit boards safely, environmentally friendly and efficiently. The crushing + low-temperature pyrolysis + physical sorting process is adopted to achieve harmless treatment of organic resins in circuit boards, and to achieve efficient separation and enrichment of valuable metals such as copper, tin, iron, aluminum, gold, silver, palladium and inorganic materials such as glass fiber. The comprehensive recovery rate of copper is more than 98%, and the recovery rate of tin is more than 91%. Solve a series of industry technical problems such as incomplete stripping of metals and non-metals, low recovery rate of copper and tin, and environmental pollution of bromide.
The system realizes efficient operation of equipment automation and intelligence through online oxygen content detection + temperature detection + central control platform + PLC + host computer centralized chain control.
Current status of waste circuit boards
Crushing System Anaerobic Pyrolysis System Secondary Combustion And Quenching System Tail Gas Treatment System
Main products obtained from physical separation
Copper Concentrate Copper Concentrate Tin Concentrate Iron Concentrate Stripped Fiber
Raw materials: mainstream FR4 copper-clad laminates and multilayer circuit boards in the market
Main ingredients: brominated epoxy resin binder, glass fiber, copper foil, etc. Its element composition usually contains 20-30% copper, and also contains precious metals such as gold, silver, and platinum.
The main ingredients of brominated epoxy resin (BER, IV) glue: bisphenol A diglycidyl ether (DGEBA, I), tetrabromobisphenol A bis (2-hydroxyethyl) ether (DGETBBA, II) and dicyandiamide (DICY, III), dicyandiamide (DICY) curing agent and other additives.
